| 选化复合工艺在沉镍金加工中问题探讨 |
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| 引用本文： | 杨卫峰. 选化复合工艺在沉镍金加工中问题探讨[J]. 印制电路信息, 2014, 0(12): 52-54 |
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| 作者姓名： | 杨卫峰 |
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| 作者单位： | 天津普林电路股份有限公司,天津300250 |
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| 摘 要： | 文章主要针对选化板在沉镍金制程加工中，出现“镍厚度不足”或“板边无镍沉积”，金盘面“凹坑”缺陷进行分析，对生产线加工参数、辅助设备、产品设计方面改善，解决产品质量。
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| 关 键 词： | 选化板 有机物 凹坑 |
Discussing the problem in the process of the selection ENIG PCB |
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| YANG Wei-feng. Discussing the problem in the process of the selection ENIG PCB[J]. Printed Circuit Information, 2014, 0(12): 52-54 |
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| Authors: | YANG Wei-feng |
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| Affiliation: | YANG Wei-feng |
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| Abstract: | The article mainly analyzes the impact of the insufifcient thickness of nickel, or slabs of nickel-free deposition, and made the analysis of the gold pad concave of the election ENIG in the ENIG PCB. It improves the process parameters, auxiliary equipment and the design of the product. |
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| Keywords: | The Election ENIG Organic Concave |
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