| 纸基覆铜板耐漏电起痕指数影响因素的试验分析 |
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| 引用本文： | 陈晓鹏,姜晓亮.纸基覆铜板耐漏电起痕指数影响因素的试验分析[J].印制电路信息,2014(9):15-17. |
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| 作者姓名： | 陈晓鹏 姜晓亮 |
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| 作者单位： | 山东金宝电子股份有限公司,山东招远265400 |
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| 摘 要： | 为了保证覆铜板的安全可靠性,覆铜板企业技术人员都在着手研究提高产品的CTI指标。本文主要内容是研究影响普通纸基覆铜板CTI指标的因素,并通过改良树脂胶黏剂的配方,使纸基覆铜板CTI指标达到零级（600 V）,并且保证了其它性能。
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| 关 键 词： | 纸基覆铜板 相比漏电痕迹指数(CTI) 树脂胶黏剂 |
Study on CTI infiuence factor of paper base Copper Clad Laminate |
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| CHEN Xiao-peng,JIANG Xiao-liang.Study on CTI infiuence factor of paper base Copper Clad Laminate[J].Printed Circuit Information,2014(9):15-17. |
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| Authors: | CHEN Xiao-peng JIANG Xiao-liang |
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| Affiliation: | CHEN Xiao-peng, JIANG Xiao-liang |
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| Abstract: | In order to ensure the safety and reliability of CCL, many CCL manufacturers are engaged in improving the CTI of production. This study is discussing the key factors that infiuence the CTI of CCL, the modified resin adhesive formula, in order to make the paper base copper clad laminate CTI index improve to 600V, and ensure its fiame retardant properties. |
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| Keywords: | Paper Base Copper Clad Laminate CTI Resin Adhesive |
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