| 导（散）热印制板 |
| |
| 引用本文： | 林金堵,吴梅珠.导（散）热印制板[J].印制电路信息,2014(7):42-45. |
| |
| 作者姓名： | 林金堵 吴梅珠 |
| |
| 作者单位： | 江南计算技术研究所,江苏无锡214083 |
| |
| 摘 要： | 概括地评论了散（导）热PCB 的发展的原因和环境，PCB的高密度化和信号传输的高频化是散（导）热PCB发展的两大主要原因，散（导）热PCB主要是通过三种方法（金属芯板、金属基板和导热性CCL）来实现。
|
| 关 键 词： | 导(散)热印制电路板 导热系数(率) 金属芯印制电路板 金属基印制电路板 高导热覆铜板 |
The conductive heat PCB |
| |
| LIN Jin-du,WU Mei-zhu.The conductive heat PCB[J].Printed Circuit Information,2014(7):42-45. |
| |
| Authors: | LIN Jin-du WU Mei-zhu |
| |
| Affiliation: | LIN Jin-du, WU Mei-zhu |
| |
| Abstract: | The paper describes the reason and environment of PCB in the conductive heat. The two large reasons of the development in conductive heat PCB are that the high density and high-frequency signal in PCB. The conductive heat PCB is realized by three methods （metal-core PCB, metal-base PCB, and high-conductive heat CCL）. |
| |
| Keywords: | Conductive Heat PCB Thermal Conductivity Metal-Core PCB Metal-base PCB High-Conductive Heat CCL |
| 本文献已被 维普 等数据库收录！ |
|
