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仿生树型超高分子量聚乙烯柔性防刺复合材料制备及其透湿性能
引用本文:张恒,甄琪,钱晓明,刘让同,张一风. 仿生树型超高分子量聚乙烯柔性防刺复合材料制备及其透湿性能[J]. 纺织学报, 2018, 39(4): 63-68. DOI: 10.13475/20170700306
作者姓名:张恒  甄琪  钱晓明  刘让同  张一风
作者单位:中原工学院;武汉纺织大学纺织纤维及制品教育部重点实验室;浙江金三发非织造布有限公司;天津工业大学纺织学院
摘    要:为获得仿生树型结构的超高分子量聚乙烯(UHMWPE)非织造复合材料,采用针刺水刺复合技术制备聚对苯二甲酸乙二醇酯/ 聚酰胺6 中空橘瓣型双组分超细纤维层夹持UHMWPE长丝层的树型柔性防刺复合材料,并对样品形态结构和理化性能进行表征。结果表明:超细纤维以纤维簇的形式在UHMWPE长丝层内形成超细纤维通道,UHMWPE长丝层与两侧超细纤维层在针刺和水刺的冲击作用下紧密缠结成仿生树型结构;针刺密度和针刺深度对透湿率有显著影响, 在针刺密度为274.37 刺/cm2, 针刺深度为7.70 mm 时, 样品透湿率为889.20 g/(m2?24 h);建立的二次方模型的置信度高,可用于仿生树型UHMWPE柔性防刺复合材料透湿性能的理论分析

关 键 词:超高分子量聚乙烯纤维  非织造材料  柔性防刺材料  树型结构  
收稿时间:2017-06-30

Preparation and moisture permeability of ultra-high molecular weight polyethylene flexible stab-resistant composite with dendritic structure
Abstract:In order to explore the ultra-high molecular weight polyethylene (UHMWPE)stab-resistant composite with a dendritic structure, a dendritic stab-resistant composite with UHMWPE filaments sandwiched between PET/PA6 hollow segmented-orange bicomponent superfine fiber layers were prepared by of combination needle punching and spunlacing. The stab resistance and moisture permeability of the samples were characterized. The results show that superfine fibers exist in theUHMWPE filament layerin the form offiber clusters to form superfine fiberchannels, the UHMWPE filament layer and the superfine fiber layers are tangled with each other to form the samples with adendritic structure under the impact ofneedle punching and spunlacing. Needling density and needling depth have significant influence on the moisture permeability, and the moisture permeability of the samples is889.20 g/(m2·24h) when the needling density is274.37 punches/cm2 and the nedling dipth is 7.70 mm. Furthermore, the quadratic models have high confidence, and can be applied in the theoretical analysis of the moisture permeability of theUHMWPE flexible stab-resistant composites with a dendritic structure.
Keywords:ultra-high molecular weight polyethylene  nonwoven fabric  stab-resistant material  dendritic structure  
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