新型三元复合络合剂体系对AZ91D镁合金表面酸性化学镀Ni-P的影响

利用含新型三元复合络合剂的酸性化学镀镍液体系,在AZ91D镁合金表面通过化学镀制备Ni-P防护镀层。结果表明,镀层沉积速率随着镀液中三元复合络合剂浓度的变化而改变。利用X射线衍射（XRD）、扫描电子显微镜（SEM）和差热分析（DSC）对镀层结构、形貌以及热稳定性进行表征和分析。通过交流阻抗（EIS）和动电位扫描极化曲线对Ni-P镀层在3.5%NaCl溶液中的耐蚀性能进行评价。镀液中三元复合络合剂的浓度对Ni-P镀层的结构与形貌有显著影响。Ni-P镀层的热稳定性随着三元复合络合剂浓度的增加而降低。当镀液中三元复合络合剂浓度为0.035 mol/L时,所制备的Ni-P镀层致密、均一,在3.5%NaCl溶液中表现出良好的耐蚀性能。

Effect of novel ternary ligand system on acidic electroless Ni-P plating on AZ91D magnesium alloy

The electroless Ni-P coatings on AZ91 D magnesium alloy substrate were prepared using the acidic hypophosphite-reduced electroless nickel bath containing the novel ternary ligand system. The results indicate that the deposition rate varies with the ternary ligand concentration in plating solution. The structural and morphological characteristics of the coatings were analyzed by XRD and SEM. The anticorrosion properties of the Ni-P coatings were evaluated in 3.5% NaCl solution by electrochemical impedance and potentiodynamic polarization methods. The amount of ternary ligands in electroless plating bath has an significant effect on the surface morphology and structure of Ni-P coatings. The decrease of crystallization temperature and increase of crystallization heat of all the deposits with an increase in ternary ligand concentration are found by DSC measurements. The coating obtained with 0.035 mol/L ternary ligand additive in plating bath can offer a better surface homogeneity and improve corrosion resistance.