Heat Dissipation Performance of Metal Core Printed Circuit Board with Micro Heat Exchanger |
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| Authors: | Diancheng Qin and Kewei Liang |
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| Affiliation: | Guangdong LED Packaging-Used Heat Dissipation Substrate Engineering Technology Research Center, Zhuhai 519180, Guangdong,China and Rayben Technologies Zhuhai Limited, Zhuhai 519180, Guangdong,China |
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| Abstract: | A Metal Core Printed Circuit Board with Micro Heat Exchanger (MHE MCPCB) was introduced for thermal management of high power LED. A comparative study was performed between 4 W/(m·K) regular MCPCB and this novel MCPCB to investigate the heat dissipation performance of this novel MCPCB. It was found that MHE MCPCB can obviously enhance the comprehensive optical properties of LED in comparison with 4 W/(m·K) regular MCPCB. Additionally, thermal contact resistance confining a dominant part of heat within the micro heat exchanger to achieve high efficient heat dissipation was proved. |
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| Keywords: | MHE MCPCB heat dissipation performance LED optical property |
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