| 基于工艺波动下的互连延时统计模型 |
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| 引用本文： | 阎丽,董刚,杨银堂,张显. 基于工艺波动下的互连延时统计模型[J]. 电路与系统学报, 2010, 15(1) |
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| 作者姓名： | 阎丽 董刚 杨银堂 张显 |
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| 作者单位： | 1. 西安电子科技大学,技术物理学院,陕西,西安,710071
2. 西安电子科技大学,微电子学院,陕西,西安,710071 |
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| 基金项目： | 国家自然科学基金(60606006);;国家杰出青年基金(60725415);;基本科研业务费资助项目 |
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| 摘 要： | 为了有效分析工艺波动对互连性能的影响,本文基于对数正态分布函数提出了一种RLC互连延时统计模型。在给定互连参数波动范围条件下,首先得到了电路矩的表达式,然后推导出了RLC互连延时均值和标准差。针对65nm和45nm的RLC互连树进行了验证,和HSPICE相比,采用本文方法计算得到的互连延时均值和标准差误差分别低于1%和5%。仿真表明本文方法具有足够的效率和精度。
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| 关 键 词： | RLC互连延时 工艺波动 统计模型 |
A statistical interconnect delay model with process fluctuations |
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| YAN Li,DONG Gang,YANG Yin-tang,ZHANG Xian. A statistical interconnect delay model with process fluctuations[J]. Journal of Circuits and Systems, 2010, 15(1) |
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| Authors: | YAN Li DONG Gang YANG Yin-tang ZHANG Xian |
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| Affiliation: | YAN Li1,DONG Gang2,YANG Yin-tang2,ZHANG Xian1 |
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| Abstract: | To effectively analyze impacts of process variations on interconnect performance, a statistical RLC delay model based on Lognormal Distribution is developed in this paper. Moments of RLC tree in the presence of process fluctuations are first obtained. Then, using the available moments, mean and standard derivation of RLC interconnect delay are both achieved. For 65nm and 45nm process technology, the errors of proposed mean and standard derivation are less than 1% and 5%, respectively. Simulations prove that... |
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| Keywords: | RLC interconnect delay process fluctuations statistical model |
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