| FR-4覆铜板外观质量改进与提高 |
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| 引用本文： | 陈应峰. FR-4覆铜板外观质量改进与提高[J]. 印制电路信息, 2003, 0(1): 37-38 |
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| 作者姓名： | 陈应峰 |
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| 作者单位： | 铜陵华瑞电子材料有限公司,244000 |
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| 摘 要： | 该文主要介绍了影响FR-4覆铜板外观质量的原因,并提出一些改进方法。
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| 关 键 词： | 基板干涸 白边白角 翘曲 厚度偏高 凹坑凹点 |
| 修稿时间： | 2002-09-02 |
The Improvement of Appearance Quality for FR-4 |
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| Chen Yingfeng. The Improvement of Appearance Quality for FR-4[J]. Printed Circuit Information, 2003, 0(1): 37-38 |
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| Authors: | Chen Yingfeng |
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| Affiliation: | Chen Yingfeng |
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| Abstract: | this article mainly tells us the cause of which effects appearance improvement on FR-4 laminate and put forward some improved methods. |
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| Keywords: | substrate dry resin starvation on edqes and corners warp thinkness too high pits and dents |
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