Mechanical properties of intermetallic compounds associated with Pb-free solder joints using nanoindentation |
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Authors: | J P Lucas H Rhee F Guo K N Subramanian |
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Affiliation: | (1) Department of Chemical Engineering and Materials Science, Michigan State University, 48824 East Lansing, MI |
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Abstract: | Mechanical properties of intermetallic compound (IMC) phases in Pb-free solder joints were obtained using nanoindentation
testing (NIT). The elastic modulus and hardness were determined for IMC phases associated with insitu FeSn particle reinforced
and mechanically added, Cu particle-reinforced, composite solder joints. The IMC layers that formed around Cu particle reinforcement
and at the Cu substrate/solder matrix interface were probed with NIT. Moduli and hardness values obtained by NIT revealed
were noticeably higher for Cu-rich Cu3Sn than those of Cu6Sn5. The Ag3Sn platelets that formed during reflow were also examined for eutectic Sn-Ag solder column joints. The indentation modulus
of Ag3Sn platelets was significantly lower than that of FeSn, SnCuNi, and CuSn IMCs. Indentation creep properties were assessed
in localized microstructure regions of the as-cast, eutectic Sn-Ag solder. The stress exponent, n, associated with secondary
creep differed widely depending on the microstructure feature probed by the indenter tip. |
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Keywords: | Intermetallic compounds Sn-Ag solder modulus hardness Ag3Sn platelet indentation creep solder joints |
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