A two-step etching method to fabricate nanopores in silicon |
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Authors: | Gou-Jen Wang Wei-Zheng Chen Kang J Chang |
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Affiliation: | (1) Department of Mechanical Engineering, National Chung-Hsing University, Taichung, Taiwan;(2) Institute of Biomedical Engineering, National Chung-Hsing University, Taichung, Taiwan;(3) Department of Manufacturing Systems Engineering, California State University, Northridge, CA, USA |
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Abstract: | A cost effective method to fabricate nanopores in silicon by only using the conventional wet-etching technique is developed
in this research. The main concept of the proposed method is a two-step etching process, including a premier double-sided
wet etching and a succeeding track-etching. A special fixture is designed to hold the pre-etched silicon wafer inside it such
that the track-etching can be effectively carried out. An electrochemical system is employed to detect and record the ion
diffusion current once the pre-etched cavities are etched into a through nanopore. Experimental results indicate that the
proposed method can cost effectively fabricate nanopores in silicon. A through pore with pore size being around 14 nm can
be fabricated. |
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