| 电镀中镍阳极残渣形成机理研究 |
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| 引用本文： | 朱艳芳,闫康平,王伟.电镀中镍阳极残渣形成机理研究[J].广州化工,2010,38(1):139-140,150. |
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| 作者姓名： | 朱艳芳 闫康平 王伟 |
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| 作者单位： | 四川大学化工学院,四川,成都,610065 |
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| 摘 要： | 用X射线衍射(XRD)对比分析实验镍渣和工厂镍渣的成分,采用恒电位扫描法测定了电解镍在电镀液中的钝化曲线,研究了氯离子浓度对镍阳极溶解行为的影响,并用扫描电镜观察了电镀后镍阳极表面的残渣形貌,探讨了镍残渣形成机理。
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| 关 键 词： | 含硫活性镍 电解镍 镍渣 电镀镍 |
The Mechanism of Slag Forming in Plating for Nickel Anode |
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| ZHU Yan-fang,YAN Kang-ping,WANG Wei.The Mechanism of Slag Forming in Plating for Nickel Anode[J].GuangZhou Chemical Industry and Technology,2010,38(1):139-140,150. |
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| Authors: | ZHU Yan-fang YAN Kang-ping WANG Wei |
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| Affiliation: | School of Chemical Engineering;Sichuan University;Sichuan Chengdu 610065;China |
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| Abstract: | The composition was contrasted and analyzed using X-ray diffraction(XRD) for the nickel slag of experiment and factory.The passivation curve of the nickel was measured by the constant potential scanning in plating solution,the influence of the chloride ion concentration on the dissolution behavior of the nickel anode was studied,and the microstructure of slag at plated nickel was investigated by the scanning electron microscope.The passivation mechanism of nickel slag was discussed |
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| Keywords: | active nickel containing sulphur electrolyze nickel nickel slag electroplate nickel |
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