| 单晶硅游离磨粒线切割技术研究 |
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| 引用本文： | 舒继千,魏昕,袁艳蕊.单晶硅游离磨粒线切割技术研究[J].工具技术,2009,43(1):31-35. |
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| 作者姓名： | 舒继千 魏昕 袁艳蕊 |
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| 作者单位： | 广东工业大学 |
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| 基金项目： | 广东省自然科学基金，广东省科技计划项目 |
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| 摘 要： | 游离磨料多线切割技术具有切割效率高、切口材料损耗小、表面损伤程度浅、切割噪声小等优点，能满足晶圆大直径化发展的加工需求。但游离磨料线切割技术发展历史短，目前还缺乏对游离磨料线切割过程材料的去除本征规律的充分认识和系统研究。本文介绍了游离磨料线切割方法的工作原理，综合分析了游离磨料线切割硅片的材料去除机理、切割线振动模型、切割温度及其影响因素等方面的研究结果，以期为游离磨料多线切割技术的深入研究和推广应用提供基础。
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| 关 键 词： | 游离磨粒线切割 切割线 单晶硅 |
Research on Free Abrasive Slicing Single Silicon Crystal Ingot Using a Wiresaw |
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| Shu Jiqian,Wei Xin,Yuan Yanrui.Research on Free Abrasive Slicing Single Silicon Crystal Ingot Using a Wiresaw[J].Tool Engineering(The Magazine for Cutting & Measuring Engineering),2009,43(1):31-35. |
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| Authors: | Shu Jiqian Wei Xin Yuan Yanrui |
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| Affiliation: | Shu Jiqian Wei Xin Yuan Yanrui,Master Degree C,idate,Guangdong University of Technology,Guangzhou 510006,China |
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| Abstract: | The free abrasive slicing technology using wiresaw has the advantages of high machining efficiency,small crystal wastage,thin surface damage layer,and low machining noise,etc.It adapts especially to slice large size silicon crystal ingot.The wiresaw slicing process and its material removal mechanism have not been known very well at the moment.This article introduces briefly the working principle of free abrasive slicing technology using wiresaw,and summarizes and analyses the research progress on the materi... |
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| Keywords: | free abrasive slicing technology using wiresaw sawing wire single silicon crystal |
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