镀锡基板表面孔洞缺陷成因分析及其控制

采用SEM微观检测分析，结合产线工艺排查，对镀锡基板表面孔洞缺陷成因进行了分析。孔洞主要是由于炼钢保护渣卷入、异物压入、氧化铁皮残留和机械损伤造成的。为此，对结晶器流场进行优化，减少液面波动，定期开展热轧设备维检，增加粗轧除鳞道次，加开精轧机架间除鳞水，加强工序产线设备工况保障，有效降低了基板表面孔洞缺陷的发生率。

Analysis on causes of hole defects on tin mill black plate

The causes of hole defect on the surface of tin mill black plate (TMBP) were analyzed by SEM. The main reason was due to slag entrapment from continuous casting, incrustation pressed-in and scale residual from hot-rolling, mechanical damage. Therefore,some measures were taken to decrease the incidence of hole defects,which include optimizing the flow field of the mold and lessening the mould level fluctuation ,regularly maintaining the hot rolling equipments ,increasing descaling passes during the rough rolling process,adding descaling unit between the mills of finish rolling process,assuring the regular working conditions of equipments ,etc. Basing on these measurement,the occurrence rate of hole defect was obviously decreased.