| 电子组装中PCBA清洗技术 |
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| 引用本文： | 宋顺美,史建卫.电子组装中PCBA清洗技术[J].电子工业专用设备,2014(4):27-37. |
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| 作者姓名： | 宋顺美 史建卫 |
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| 作者单位： | 日东电子科技 深圳 有限公司，广东深圳，518103 |
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| 摘 要： | 清洗对于电子产品可靠性有着非常重要的影响,针对印制电路组件污染物进行了系统阐述,并对不同的清洗技术和工艺进行了总结归纳,讨论了影响清洗效果的各个因素及其检验规范,为实际生产起到了指导性作用。
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| 关 键 词： | 印制电路组件 污染物 助焊剂残留 清洗技术 离子浓度 半水清洗工艺 |
Cleaning Technology for PCBA in Electronics Assembly |
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| SONGShunmei
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SHIJianwei.Cleaning Technology for PCBA in Electronics Assembly[J].Equipment for Electronic Products Marufacturing,2014(4):27-37. |
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| Authors: | SONGShunmei SHIJianwei |
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| Affiliation: | (Suneast Electronics Science and Technology Co., Ltd., Shenzhen518103, China) |
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| Abstract: | Cleaning is most im portant procedure for electronic products reliability possesses. The article introduces the contam inations adhere to PCB A and sum m arizes different cleaning techniques and process of PCB A cleaning and discusses the factors affecting the cleaning effect and inspection specification.Thatbringsguiding role forproduction. |
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| Keywords: | PCBA(Print Circuit B oard A ssem bly) Contam ination Flux residues Cleaning technology Ion concentration Sem i-aqueous cleaning process |
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