| 微流控芯片微通道热压成形中塑料流动的仿真 |
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| 引用本文： | 尉元杰,刘冲,李经民,彭佳,祝连义.微流控芯片微通道热压成形中塑料流动的仿真[J].传感技术学报,2006,19(5):2008-2010. |
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| 作者姓名： | 尉元杰 刘冲 李经民 彭佳 祝连义 |
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| 作者单位： | 1. 大连理工大学,辽宁省微纳米技术及系统重点实验室,大连,116023
2. 大连理工大学精密与特种加工技术教育部重点实验室,大连,116023 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 目前,PMMA微流控芯片微通道成形过程中热压参数的调整周期很长.针对这一问题,本文基于热粘弹性理论建立微通道成形过程中的热-应力耦合场模型,利用有限元软件对微通道热压成形过程进行了仿真,通过对不同压力、温度和时间下微通道成形的仿真,得出了最优化的工艺参数.实验结果验证了仿真结论,可以实现对微流控芯片微通道热压成形过程的快速有效的控制.
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| 关 键 词： | 热粘弹性 微通道成形 仿真 |
| 文章编号： | 1004-1699(2006)05-2008-03 |
| 修稿时间： | 2006年7月1日 |
Simulation of plastic flow in microchannel figuration of microfluidic chip under hot embossing |
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| Wei Yuan-jie,Liu Chong,Li Jing-min,Peng Ji,Zhu Lian-yi.Simulation of plastic flow in microchannel figuration of microfluidic chip under hot embossing[J].Journal of Transduction Technology,2006,19(5):2008-2010. |
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| Authors: | Wei Yuan-jie Liu Chong Li Jing-min Peng Ji Zhu Lian-yi |
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| Affiliation: | 1 Key Laboratory for Micro/Nano Technology and System of Liao Ning Province, Dalian University of Technology, 116023;2 Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology |
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| Abstract: | At present, a long period is needed to adjust parameters of microchannel figuration under hot embossing for the fabrication of PMMA microfluidic chip. The author set up the model of thermal-stress coupled field and simulates the flow process of PMMA microchannel figuration under hot embossing with finite element analysis software based on the theory of heat viscoelasticity in order to meet the fast and efficient requirement of rectifying technical parameters. Through the simulation of different pressure, temperature and time, perfect technicas parameters, were obtained.The results of the experiments proved that the conclusions of simulation were available. The studies showed that it was efficient to control the hot embossing process through the simulation. |
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| Keywords: | heat viscoelasticity microchannel figuration simulation |
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