| 电子封装用无铅焊料的最新进展 |
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| 引用本文： | 黄卓,张力平,陈群星,田民波. 电子封装用无铅焊料的最新进展[J]. 半导体技术, 2006, 31(11): 815-818 |
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| 作者姓名： | 黄卓 张力平 陈群星 田民波 |
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| 作者单位： | 清华大学,材料科学与工程系,北京,100084;振华亚太高新电子材料有限公司,贵州,贵阳,550018 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 随着WEEE/RoHS法令的颁布,电子封装行业对于无铅焊接提出了更高的要求.根据国际上对无铅焊料的最新研究进展提出了无铅焊料"三大候选"的概念.总结了目前无铅焊料尚存的三大主要弱点,并对国际上推荐使用的几种无铅焊料的优缺点进行了概述.
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| 关 键 词： | 无铅焊料 候选焊料 熔点 稳定性 |
| 文章编号： | 1003-353X(2006)11-0815-04 |
| 收稿时间： | 2006-03-01 |
| 修稿时间： | 2006-03-01 |
Recent Development of Lead-Free Solder in Electronic Packaging |
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| HUANG Zhuo,ZHANG Li-ping,CHEN Qun-xing,TIAN Min-bo. Recent Development of Lead-Free Solder in Electronic Packaging[J]. Semiconductor Technology, 2006, 31(11): 815-818 |
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| Authors: | HUANG Zhuo ZHANG Li-ping CHEN Qun-xing TIAN Min-bo |
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| Affiliation: | 1. Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China; 2. Zhenhua Asia-Pacific High-Tech Electronic Materials Co., Ltd, Guiyang 550018, China |
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| Abstract: | Along with the issue of WEEE/RoHS, electronic packaging industry raised the further requirement for lead-free jointing. The three substitutes of lead-free solder were brought forward according to the recent research. Three main weaknesses about the lead-free solder being used nowadays were summarized, and a summarization of the advantages and disadvantages about the international recommended lead-free solders were made as well. |
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| Keywords: | lead-free solder substituted solder melting point stability |
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