Formation of Two-Component Vertical Contact Structures for Mounting Integrated-Circuit Chips |
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| Authors: | V. M. Roshchin I. N. Petukhov K. S. Sen’chenko A. V. Roshchina T. V. Shilina |
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| Affiliation: | 1.National Research University of Electronic Technology (MIET),Zelenograd, Moscow,Russia |
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| Abstract: | The technological capabilities of the layer-by-layer electrochemical formation of vertical contact structures based on a copper–tin system for mounting silicon chips, including 3D technologies, have been considered. The possibility of fixing a chip–board clearance for the preventing a short circuit between the contact areas with the solder material has been shown. |
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