Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression |
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Authors: | Chang Dong Zou Yu Lai Gao Bin Yang Xin Zhi Xia Qi Jie Zhai Cristina Andersson Johan Liu |
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Affiliation: | (1) Shanghai Key Laboratory of Modern Metallurgy & Materials Processing, Shanghai University, Shanghai, 200072, P.R. China;(2) Department of Microtechnology and Nanosciences (MC2) & SMIT Center, Chalmers University of Technology, 412 96 Goteborg, Sweden;(3) SMIT Center and␣School of Automation and Mechanical Engineering, Shanghai University, Shanghai, 200072, P.R. China |
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Abstract: | Due to the toxicity of lead (Pb), Pb-containing solder alloys are being phased out from the electronics industry. This has
lead to the development and implementation of lead-free solders. Being an environmentally compatible material, the lead-free
Sn-3.0Ag-0.5Cu (wt.%) solder alloy is considered to be one of the most promising alternatives to replace the traditionally
used Sn-Pb solders. This alloy composition possesses, however, some weaknesses, mainly as a result of its higher melting temperature
compared with the Sn-Pb solders. A possible way to decrease the melting temperature of a solder alloy is to decrease the alloy
particle size down to the nanometer range. The melting temperature of Sn-3.0Ag-0.5Cu lead-free solder alloy, both as bulk
and nanoparticles, was investigated. The nanoparticles were manufactured using the self-developed consumable-electrode direct
current arc (CDCA) technique. The melting temperature of the nanoparticles, with an average size of 30 nm, was found to be
213.9°C, which is approximately 10°C lower than that of the bulk alloy. The developed CDCA technique is therefore a promising
method to manufacture nanometer-sized solder alloy particles with lower melting temperature compared with the bulk alloy. |
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Keywords: | Lead-free solder melting temperature depression nanoparticles Sn-3 0Ag-0 5Cu |
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