| 用于IC封装的光刻设备 |
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| 引用本文： | 童志义.用于IC封装的光刻设备[J].电子工业专用设备,2007,36(8):6-10,20. |
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| 作者姓名： | 童志义 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所,北京东燕郊,065201 |
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| 摘 要： | 光刻是圆片级封装的一种最重要的工艺,无论是焊盘分布、焊凸形成、密封或其它新出现的需求,晶圆上精确的成像区域对每一种工序来讲是最重要的。评述了一些圆片级封装的光刻系统及为什么某些专门的设备能很好地适于应用,会是接近式光刻机、步进投影光刻机还是一些替代设备在未来的几年内来满足这种需求?我们将探索这种可能性。
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| 关 键 词： | 圆片级封装 焊凸形成 光刻设备 近式光刻机 |
| 文章编号： | 1004-4507（2007）08-0006-05 |
| 修稿时间： | 2007-07-24 |
Photolithography Tools for IC Packaging |
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| TONG Zhi-yi.Photolithography Tools for IC Packaging[J].Equipment for Electronic Products Marufacturing,2007,36(8):6-10,20. |
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| Authors: | TONG Zhi-yi |
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| Affiliation: | The 45th Research Insitute of CETC, Beijing East Yanjiao 065201, China |
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| Abstract: | Lithography is an absolutely essential process for wafer-level packaging, whether for pad redistribution, bumping, encapsulation or other emerging needs, precisely imaging areas on the wafer is essential for each process step. This article looks at several WLP lithography systems to see why certain specific approaches are working well. Will proximity aligners, wafer steppers, or some alternative tool dominate the process in years to come?We will explore the possibilities. |
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| Keywords: | Wafer-level Packaging Bumping Lithography Tools Proximity Aligners |
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