| 印制电路板铜面保护层对无铅焊点结构影响 |
| |
| 引用本文： | 肖代红,吴金昌,陈方泉,黄云宇.印制电路板铜面保护层对无铅焊点结构影响[J].电子工艺技术,2005,26(4):197-199. |
| |
| 作者姓名： | 肖代红 吴金昌 陈方泉 黄云宇 |
| |
| 作者单位： | 英顺达科技有限公司研发品保中心,上海,201114;英顺达科技有限公司研发品保中心,上海,201114;英顺达科技有限公司研发品保中心,上海,201114;英顺达科技有限公司研发品保中心,上海,201114 |
| |
| 摘 要： | 采用扫描电镜与能谱测试，研究了两种不同印刷电路板铜面保护层，即有机保护层(Organic Solderability Preservatives，OSP)与浸银层(Immersion Ag，I—Ag)，对无铅焊点结构的影响。结果显示，采用有机保护层的焊接界面金属间化合物层厚度明显超过了浸银层；在两种不同保护层中的焊点中，均出现薄片状或树枝状Ag3Sn金属间化合物，但在浸银层焊点中，薄片状Ag3sn主要在焊接界面层处非均匀形核长大，而有机保护层焊点中，薄片状Ag3Sn较少出现，代之以树枝状Ag3Sn近似均匀地分布在焊点中。断口分析显示，采用有机保护层的焊点中出现了较多的气孔，而且气孔主要出现在靠近铜面焊点中，这明显降低了焊点的强度。
|
| 关 键 词： | 无铅焊接 铜面保护层 焊接界面 金属间化合物 |
| 文章编号： | 1001-3474(2005)04-0197-03 |
| 修稿时间： | 2005年5月19日 |
Effect of Cu Surface Finishes of Printed Circuit Board on the Microstructure of Lead - Free Solder Joint |
| |
| XIAO Dai-hong,WU Jin-Chang,CHEN Fang-quan,HUANG Yun-yu.Effect of Cu Surface Finishes of Printed Circuit Board on the Microstructure of Lead - Free Solder Joint[J].Electronics Process Technology,2005,26(4):197-199. |
| |
| Authors: | XIAO Dai-hong WU Jin-Chang CHEN Fang-quan HUANG Yun-yu |
| |
| Abstract: | Effect of Cu surface finishes,including organic solderability preservatives (OSP) and immersion Ag (I-Ag),on the microstructure of lead-free solder joint was investigated with scanning electron microscope and energy dispersive X-ray spectroscopy).It was found that Cu surface finishes affected the microstructure of lead-free solder joint.The thickness of intermetallic compounds (IMC) layer with OSP was higher than that of I-Ag.Comparing with OSP,there are more plate-like Ag_3Sn intermetallic compounds between solder joints and Cu pad after I-Ag surface finishing.However,there are more voids found in the solder joints which distributed close to the solder interface and reduced the strength of solder joints after OSP surface finishing. |
| |
| Keywords: | Lead-free soldering Cu pad surface finishes Solder interface Intermetallic compound |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
