E-beam direct wafer writing process using a water-solubleconductive layer |
| |
| Authors: | Watanabe H Todokoro Y |
| |
| Affiliation: | Matushita Electron. Corp., Kyoto; |
| |
| Abstract: | The water-soluble conductive layer(WSCL) is ammonium poly (p-styrene sulfonate) having ionic conductivity and water solubility. The process consists of applying thin WSCL to the e-beam resist surface prior to the conventional exposure step. WSCL is subsequently removed and the e-beam resist developed in the ordinary way. The process has general utility for various resists, eliminating charging effects caused by -beam exposure |
| |
| Keywords: | |
|
|
