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Enhanced low-temperature sintering of tungsten
Authors:R. M. German and Z. A. Munir
Affiliation:(1) Metallurgy and Electroplating Division 8312, Sandia Laboratories, 94550 Livermore, CA;(2) Materials and Devices Research Group, Department of Mechanical Engineering, University of California, 95616 Davis, CA
Abstract:The effects of various transition metal additions on the sintering of a well-characterized, fine tungsten powder were analyzed using both isothermal and constant heating rate experiments in the temperature range 900 to 1400‡ C. Approximately four atomic monolayers of palladium on the tungsten powder surface were found to be the optimal enhancer, followed by nickel, cobalt, platinum, and iron. The addition of Cu to the tungsten had no appreciable effect on the sintering kinetics. Sintering enhancement by these transition metals is related to their periodic chart position(i.e., electron structure). An overall non-Arrhenius shrinkage temperature dependence is attributed to grain growth in the activator-treated specimens. The activation energy for tungsten densification was determined to be 430 to 450 kJ/mol, which is in general agreement with a grain boundary diffusion process.
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