Influence of methacryl polyhedral oligomeric silsesquioxane on the thermal and mechanical properties of methylsilicone resin |
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| Authors: | Y. R. Liu Y. D. Huang L. Liu |
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| Affiliation: | Department of Material Science, Institute of Chemistry and Material Science, Shanxi Normal University, Linfen City, Shanxi Province, 041004 (P. R. China) |
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| Abstract: | A methacryl polyhedral oligomeric silsesquioxane (POSS)‐reinforced methylsilicone resin was prepared in this work. The structures of the obtained products were confirmed with Fourier transform infrared and atomic force microscopy. The influence of methacryl‐POSS on the thermal behavior of the methylsilicone resin was studied by thermogravimetric analysis and isothermal thermogravimetric analysis. The results showed that the thermal stability of the methylsilicone resin was improved, and the degree of thermooxidative degradation was lowered; this was due to the retardation of polymer chain motion and the formation of a protective layer of SiO2. The interlaminar shear strength and flexural strength of quartz fiber/methylsilicone resin composites were tested to determine the effects of methacryl‐POSS on the mechanical properties of methylsilicone resin. The results revealed that the mechanical properties of the methylsilicone composites also increased obviously after the incorporation of methacryl‐POSS because of the increase in the cure degree and rigidity of the resin. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008 |
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| Keywords: | mechanical properties silicones thermal properties thermogravimetric analysis (TGA) |
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