| 一种CMP试验装置的研制 |
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| 引用本文： | 鱼胜利,吉方,陈东生.一种CMP试验装置的研制[J].组合机床与自动化加工技术,2011(1). |
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| 作者姓名： | 鱼胜利 吉方 陈东生 |
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| 作者单位： | 中国工程物理研究院,机械制造工艺研究所,四川,绵阳,620019 |
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| 基金项目： | 中国工程物理研究院科学技术发展基金资助 |
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| 摘 要： | 通过机械加工使硬脆材料达到亚微米级的平面度,纳米级的粗糙度是非常困难的,而广泛应用于Ic加工领域的化学机械抛光(CMP)则能够实现工件的高精度加工要求.为此,设计了一台高精度的CMP试验装置,该装置用触摸屏完成人机对话,PLC作为整个测控系统的核心控制部分,通过接1:2完成数字、模拟信号的采集和对执行机构的控制,结构上具有结构简洁、控制方便的特点.在该装置上加工的直径100mm的不锈钢工件,平面度和粗糙度均达到或超过了设计要求.
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| 关 键 词： | 试验装置 化学机械抛光 全局平面化 人机对话 可编程控制器 |
Development for One Kind of CMP Trial Device |
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| YU Sheng-li,JI Fang,CHEN Dong-sheng.Development for One Kind of CMP Trial Device[J].Modular Machine Tool & Automatic Manufacturing Technique,2011(1). |
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| Authors: | YU Sheng-li JI Fang CHEN Dong-sheng |
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| Affiliation: | YU Sheng-li,JI Fang,CHEN Dong-sheng(China Academy of Engineering Physics,Institute of Mechanical Manufacturing Technology,Mianyang Sichuan 620019,China) |
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| Abstract: | It is very difficult that hard brittle materials reach sub-micron planar degree and nanoscale roughness by mechanical processing.Chemical machinery polishing widely used in the field of IC processing can achieve precision machining requirements of the workpiece.Therefore,a high-precision CMP test device is designed,this device cmplete man-machine dialogue with touch screen,PLC as the core control,digital and analog signal acquisition and the control of actuators through the interface,the characteristics of ... |
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| Keywords: | test device chemical mechanical polishing(CMP) global planarization man-machine dialogue programmable controller(PLC) |
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