The stress dependence of the subgrain size in aluminium

Etch-pit (EP) technique and transmission electron microscopy (TEM) have been used to investigate the subgrain size, , as a function of applied shear stress, , during high-temperature creep of aluminium. Examination of thin foils, prepared from deformed specimens, in the electron microscope shows the presence of very large equiaxed sub-grains that approximate those observed in etch-pit photographs. By measuring the average subgrain size from transmission micrographs of representative areas of the foils, two observations are made. First, the average subgrain size is smaller than that determined from etch-pit procedure, but exhibits the same stress dependence: /b (/G)^– where b is the Burgers vector and G is the shear modulus. Second, the TEM subgrain size data of aluminium and those of other metals and alloys, when plotted in the normalized form of /Gb against /Gb on a logarithmic scale, where is the stacking-fault energy of the material, fall within a narrow, horizontal band, confirming earlier reports that the subgrain size is insensitive to stacking-fault energy.