单层磨料凝胶抛光垫的加工性能研究

目的 研究单层磨料凝胶抛光垫的加工性能,为提高磨料利用率以及降低磨料对凝胶基体的破坏提供解决思路.方法 使用自行搭建的测力装置,对磨粒与基体的界面结合强度进行研究,分析磨料粒度和偶联剂对界面结合强度的影响,研究磨料粒度和结合剂厚度对磨粒附着的影响,并将制备的单层磨料凝胶抛光垫与常规多层磨料凝胶抛光垫分别在湿抛光和干抛光工艺条件下加工碳化硅衬底,对比两者的材料去除率、表面粗糙度和工具的磨损情况.结果 200/230目金刚石磨粒的界面结合强度是80/100目的4倍有余,添加偶联剂后,80/100目金刚石磨料与基体的界面结合强度提高了75％.粗粒度的W40多层磨料容易破坏凝胶基体的结构,而细粒度的W5单层磨料不会破坏凝胶基体结构,且单层磨料工具的凝胶体涂覆厚度应低于0.6 mm.湿抛光条件下,单层磨料工具能达到多层磨料工具的抛光效果;干抛光条件下,单层磨料工具的材料去除率相比多层磨料工具提升11.5％;湿抛光和干抛光条件下,单层磨料凝胶工具的耐磨性都显著强于多层磨料工具.结论 单层磨料凝胶工具在湿抛光条件下具有与多层磨粒凝胶工具等效的加工能力,但是在干抛光条件下,单层磨料凝胶工具的加工能力和使用寿命要显著优于多层磨料凝胶工具.

Study on the Processing Property of Monolayer Abrasive Sol-Gel Polishing Pad

This work aims to study the processing properties of the monolayer abrasive sol-gel polishing pad, thereby providing a solution for improving abrasive utilization and reducing the damage of abrasive to gel matrix. The self-made force measuring device was used to study the interfacial bonding strength between abrasive and matrix. The effects of abrasive size and coupling agent on interfacial bonding strength were analyzed, also the effects of abrasive size and matrix thickness on abrasive adhesion were studied. The monolayer abrasive polishing pad and the conventional multilayer abrasive polishing pad were conducted to process silicon carbide substrate under the wet and dry polishing conditions respectively, and the material removal rate, surface roughness and wear condition of polishing pads were analyzed. The results showed that the interfacial bonding strength of 200/230 mesh diamond abrasive was more than four times than that of 80/100 mesh, and the interfacial bonding strength of 80/100 mesh diamond abrasive was increased by 75% after adding coupling agent. The structure of gel matrix was easily destroyed by coarse-grained W40 multilayer abrasives, but not damaged by fine-grained W5 monolayer abrasives. The coating thickness of gel matrix of monolayer abrasive pad should be less than 0.6 mm. Under the condition of wet polishing, the processing performance of monolayer abrasive pad was similar to multilayer abrasive pad. The material removal rate of monolayer abrasive pad was 11.5% higher than that of multilayer abrasive pad under the condition of dry polishing. Whether in wet or dry polishing conditions, the wear resistance of monolayer abrasive pad was obviously stronger than that of multilayer abrasive pad. Therefore, the monolayer abrasive sol-gel polishing pad had the same processing properties as the multilayer abrasive one under wet polishing condition. However, the processing ability and service life of the monolayer abrasive tool were remarkably better than that of the multilayer abrasive tool under the condition of dry polishing.