| 无钯活化的化学镀镍工艺的研究 |
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| 引用本文： | 陈均,朱爱平. 无钯活化的化学镀镍工艺的研究[J]. 电镀与环保, 2006, 26(3): 23-24 |
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| 作者姓名： | 陈均 朱爱平 |
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| 作者单位： | 盐城卫生职业技术学院,化学系,江苏,盐城,224006;常德力元新材料有限责任公司,湖南,常德,415001 |
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| 摘 要： | 采用无钯活化的化学镀镍前处理,对丁二酸钠及甘氨酸在化学镀镍体系中上镍量及化学镀镍液催化的诱导期的实验,研究了在制取泡沫镍过程中适用于无钯活化的化学镀镍工艺.
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| 关 键 词： | 无钯 化学镀镍 |
| 文章编号： | 1000-4742（2006）03-0023-01 |
| 收稿时间： | 2005-10-28 |
| 修稿时间： | 2005-10-28 |
A Study of Electroless Nickel Plating with Pd-free Activation |
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| CHEN Jun,ZHU Ai-ping. A Study of Electroless Nickel Plating with Pd-free Activation[J]. Electroplating & Pollution Control, 2006, 26(3): 23-24 |
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| Authors: | CHEN Jun ZHU Ai-ping |
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| Affiliation: | 1. Chemistry Department, College of Yancheng Sanitary Occupation Technology, Yancheng 224006, China ; 2. Changde Lyrun New Material Co., Ltd., Changde 415001, China |
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| Abstract: | Through the experiment and summary of the quantity of plated nickel and the catalysis of electroless plating solution in the induction period of the pretreatment by using sodium succinate and glyince,a process is obtained,which can reduce the dosage of precious metal Pd and improve the stability of electroless plating solution,and is suitable for the process of foamed nickel preparation without Pd activation. |
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| Keywords: | Pd-free electroless nickel plating |
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