| 电子接插件的快速连续电镀方法 |
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| 引用本文： | 马今朝. 电子接插件的快速连续电镀方法[J]. 电子工艺技术, 1999, 20(1): 27-29 |
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| 作者姓名： | 马今朝 |
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| 作者单位： | 黑龙江商学院电子系,哈尔滨,150076 |
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| 摘 要： | 介绍了适于电子接插件的快速连续电镀金、钯及Ｓｎ－Ｐｂ合金工艺的流程、操作要领等，对镀层的性能进行了分析比较，提出了快速电镀应解决的问题。
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| 关 键 词： | 电镀 电子接插件 镀金 镀钯 |
| 修稿时间： | 1998－11－06 |
Fast Continuous Electroplating for Electronic Connectors |
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| Ma Jinzhao. Fast Continuous Electroplating for Electronic Connectors[J]. Electronics Process Technology, 1999, 20(1): 27-29 |
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| Authors: | Ma Jinzhao |
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| Abstract: | The processes and operating conditions of the fast continuous electroplating gold,palladium and Sn-Pb alloy for electronic connectors were introduced.The properties of gold coating and palladium coating were discussde.The problem for fast continuous plating was pointed out. |
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| Keywords: | Electroplating Electronic connector Gold plating Palladium plaging |
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