The effect of metal coatings on the interfacial bonding strength of ceramics to copper in sintered Cu-SiC composites |
| |
| Affiliation: | 1. Institute of Fundamental Technological Research, Polish Academy of Sciences, Warsaw, Poland;2. Faculty of Mechatronics, Warsaw University of Technology, Warsaw, Poland;3. Institute of Physics, Polish Academy of Sciences, Warsaw, Poland;4. Institute of Electronic Materials Technology, Warsaw, Poland;1. Division of Materials Engineering, Department of Engineering, University of Maragheh, Maragheh, East Azerbaijan, Iran;2. Materials and Energy Research Center (MERC), P.O. Box 14155-4777, Tehran, Iran;3. Department of Materials Science and Engineering and Institute for Nanoscience and Nanotechnology, Sharif University of Technology, P.O. Box 11365-9466, Tehran, Iran;4. Department of Materials Science and Engineering, Pohang University of Science and Technology, Pohang 790-784, South Korea;1. Materials and Energy Research Center (MERC), P.O. Box 14155-4777, Tehran, Iran;2. Department of Materials Science and Engineering, Pohang University of Science and Technology, 790-784 Pohang, South Korea;3. Department of Materials Science and Engineering, Institute for Nanoscience and Nanotechnology, Sharif University of Technology, P.O. Box 11365-9466, Tehran, Iran;1. Institute of Fundamental Technological Research, Poland;2. Institute of Electronic Materials Technology, Poland;3. Institute of Physics, Poland;1. Otto-von-Guericke-University Magdeburg, Chemical Institute – Industrial Chemistry, Universitätsplatz 2, Magdeburg 39106, Germany;2. Otto-von-Guericke-University Magdeburg, Institute for Materials and Joining Technology, Universitätsplatz 2, Magdeburg 39106, Germany;1. Faculty of Engineering and the Environment, University of Southampton, Highfield, Southampton SO17 1BJ, United Kingdom;2. Faculty of Physical Sciences and Engineering, University of Southampton, Highfield, Southampton SO17 1BJ, United Kingdom |
| |
| Abstract: | Cu-SiC composites are very promising materials which have high thermal and electrical conductivity and may find many applications. Unfortunately, the main disadvantage of these materials is the dissolution of silicon in copper at elevated temperature, which significantly reduces their properties. In order to overcome this problem particles can be coated with a protective material before sintering. In this paper– the influence of three different metallic coatings on bonding strength were investigated. SiC particles were coated with tungsten, chromium or titanium. As reference a material with uncoated particles was prepared. The experiments were carried out with the use of microtensile tester. The highest increase in strength was observed in the case of chromium coating. On the other hand, the titanium coating, which was of very poor quality, decrease the bonding strength in comparison with uncoated particles. Furthermore, scanning electron and optical microscopes were used to determine the mechanism of debonding. |
| |
| Keywords: | Interfacial bonding strength Metal matrix composites Tensile strength Silicon carbide particles |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
