Synthesis and characterization of ceramic nanoparticles reinforced lead-free solder |
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| Affiliation: | 1. Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111, Iran;2. Research Institute for Steel, Isfahan University of Technology, Isfahan 84156-83111, Iran;1. School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, 100081, China;2. Materials Science and Engineering Program, Department of Nanoengineering, University of California, San Diego, La Jolla, CA, 92093, USA;1. School of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210003, China;2. College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;3. Sino-French Institute of Nuclear Engineering and Technology, Sun Yat-Sen University, Zhuhai 519082, China;4. New Energy Technology Engineering Laboratory of Jiangsu Province & School of Science, Nanjing University of Posts and Telecommunications, Nanjing 210023, China;1. ENEA-UTAPRAD, C.R. Frascati, via E. Fermi 45, 00044 Frascati, Roma, Italy;2. ENEA-UTTMAT, C.R. Casaccia, via Anguillarese 301, 00123 Roma, Italy;3. NILPRP, Lasers Department, 409 Atomistilor, 077125 Magurele-IF, Bucharest, Romania;1. Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, 4072 St Lucia, Queensland, Australia;2. Centre of Excellence Geopolymer and Green Technology, School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah 02600, Jejawi, Arau, Perlis, Malaysia;1. School of Materials Science and Engineering, Wuhan University of Technology, Wuhan, 430070, China;2. Department of Materials Science and Engineering, The University of Sheffield, Sheffield, S1 3JD, UK;3. Fujian Key Laboratory of Advanced Materials, College of Materials, Xiamen University, Xiamen, 361005, China;4. Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen, 518055, China;1. Basic Science Department, Higher Technological Institute, 44629 10th of Ramadan City, Egypt;2. Physics Department, Faculty of Science, Suez-Canal University, 41522 Ismailia, Egypt;3. Recruitment Department, University of Hail, Hail 2440, Saudi Arabia;4. Texas State University-San Marcos, Department of Chemistry and Biochemistry, 601 University Dr., San Marcos, TX 78666, USA |
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| Abstract: | Sn-0.7Cu is among the least expensive types of lead-free solders available. However, its poor mechanical properties have limited its application. In this study, Sn-Cu lead-free solder reinforced with amorphous silica (SiO2) nanoparticles was synthesized through powder metallurgy route. Desired mixtures of raw materials was mechanically milled, compressed, sintered and extruded to prepare bulk solder samples. The samples were characterized by optical and electron microscopy as well as mechanical tests. The results showed that mechanical properties were increased by addition of SiO2 nanoparticles to the solder matrix. Addition of 1.5 wt% ceramic reinforcement to the composite increased tensile, yield and compressive strengths up to 27%, 23% and 41%, respectively, compared to those of the monolithic sample. In addition, the ceramic nanoparticles caused an up to 50% decrease in the wetting angle between the substrate and the nanocomposite solder. |
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| Keywords: | Lead-free solder Nanocomposite Sn-Cu Mechanical properties Microstructure Wettability |
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