| 新型的化学镀锡在无铅焊接之运用 |
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| 引用本文： | 张志祥,张敏成. 新型的化学镀锡在无铅焊接之运用[J]. 印制电路信息, 2005, 0(10): 32-36 |
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| 作者姓名： | 张志祥 张敏成 |
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| 作者单位： | 常州康斯脉电子科技有限公司 |
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| 摘 要： | 阐述线路板的绿色表面涂覆的化学镀锡工艺的有关理论和技术,化学镀锡应用是实现取代热风整平表面涂覆绿色化的最重要的手段之一。我司第三代化学镀锡应用是突破目前化学沉锡的供应商共拥硫脲作为电位改变剂配方此环节,是一种新型独特的科技。
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| 关 键 词： | 线路板 化学镀锡 热风整平 绿色表面涂覆 电位改变剂 |
New Electroless Tin Process for Lead-free Soldering |
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| Zhang Zhixiang,Zhang Mincheng. New Electroless Tin Process for Lead-free Soldering[J]. Printed Circuit Information, 2005, 0(10): 32-36 |
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| Authors: | Zhang Zhixiang Zhang Mincheng |
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| Affiliation: | Zhang Zhixiang Zhang Mincheng |
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| Abstract: | This paper describes the theoretics and technology of electroless tin at surface coating of environmentprotected, electroless tin using is the one of the best important way for replace hot air solder leveling process in surfacecoating of environment protected. The third generation of electroless tin solution in our company break throughpresent other suppliers use thiourea as voltage drop agent, it is a new style technology. |
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| Keywords: | printed circuit board electroless tin hot air solder leveling surface coating ofenvironment protected voltage drop agent |
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