波峰焊过程产生板脏问题的分析和解决方法

实施无铅化工艺后,导入新的无铅波峰焊设备.在生产过程中,有时会发现被焊接板底面焊点之间粘有脏物,导致电路漏电,造成电气故障.经分析,主要原因为部件板在过波峰焊时,因设备相关问题,锡炉锡渣粘到印制板上造成.根据一年多跟踪与分析,提出相应解决办法.

Problems and Solutions of PCB Dirty During Wave Soldering

Introduce new lead-free wave soldering equipment after lead-free solder technology put in practice.It is found that there are sticky things between solder joints on the bottom surface of PCB sometimes during wave soldering.The sticky things lead to circuit leakage and cause electrical faults.The main reason is that the tin slag was stuck on the bottom surface of PCB during wave soldering because of some problems relative to the equipment.Put forward the solutions based on one year tracking production and analyzing problems.