C/SiC复合材料组织对磨削力与加工表面质量的影响

采用树脂结合剂金刚石砂轮对C/SiC复合材料与SiC陶瓷进行了平面磨削加工试验,通过对比两种材料的磨削力及磨削加工表面质量,分析了C/SiC复合材料组织与其磨削加工特性的 关系。研究结果表明,C/SiC复合材料中碳纤维及SiC基体皆以脆性断裂方式实现材料去除;与SiC陶瓷的加工表面(其表面粗糙度值Ra为0.2~0.3μm)相比,C/SiC复合材料磨削时由于碳纤维层状断裂、拔出及其与SiC非同步去除现象导致其加工表面粗糙度值较高, Ra为0.8~1.0μm;C/SiC复合材料磨削力较小，是相同工艺参数下SiC陶瓷材料磨削力的35%~76%。

Effect of C/SiC Composites Material Structure on Grinding Forces and Machined Surface Quality

Surface grinding test was conducted on C/SiC and SiC materials with resin bond diamond wheel.The grinding forces and ground surface quality of C/SiC composites and SiC ceramic were analyzed comparatively and the relations between material structure and grinding performance were studied.The results show that both carbon fibers and SiC matrix are removed by mechanism of brittle fracture.Compared with the ground surface roughness of SiC ceramic(Ra=0.2~0.3μm)， the worse surface roughness of C/SiC composites(Ra=0.8~1.0μm) results from  the laminated fracture mechanism,pull-out of carbon fiber and nonsynchronous material removing of carbon fiber and SiC matrix.Additionally,the grinding forces of C/SiC composites are as 35%~76% of SiC ceramic's with the same parameters.