| 微电子封装技术对SMT的促进作用 |
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| 引用本文： | 况延香,朱颂春.微电子封装技术对SMT的促进作用[J].电子与封装,2004,4(2):1-5. |
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| 作者姓名： | 况延香 朱颂春 |
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| 作者单位： | 中国电子科技集团公司第43研究所,安徽,合肥,230022;中国电子科技集团公司第43研究所,安徽,合肥,230022 |
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| 摘 要： | SMD是SMT的三要素之一,并为SMT的基础。而微电子封装技术又是SMD的基础与核心。本文论述了先进IC封装技术对SMT的推动作用。
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| 关 键 词： | 微电子封装 SMD SMT |
| 修稿时间： | 2003年7月21日 |
Driving for SMT by advanced Microelectronics Packaging |
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| Kuang Yanxiang,Zhu Songchun China Electroincs Technology Group Corporation No. Research Institute,Hefei Anhui.Driving for SMT by advanced Microelectronics Packaging[J].Electronics & Packaging,2004,4(2):1-5. |
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| Authors: | Kuang Yanxiang Zhu Songchun China Electroincs Technology Group Corporation No Research Institute Hefei Anhui |
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| Affiliation: | Kuang Yanxiang,,Zhu Songchun China Electroincs Technology Group Corporation No.43 Research Institute,Hefei Anhui 230022 |
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| Abstract: | SMD is one of three basic elements in SMT. Microelectronics packaging is the basic and the core ofSMD. The driving for SMT by advanced IC packaging is described in the paper. |
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| Keywords: | Microelectronics packaging SMD SMT |
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