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小型化硅微谐振式加速度计的实现与性能测试
引用本文:赵健,施芹,夏国明,裘安萍,吴志强,苏岩.小型化硅微谐振式加速度计的实现与性能测试[J].光学精密工程,2016,24(8):1927-1933.
作者姓名:赵健  施芹  夏国明  裘安萍  吴志强  苏岩
作者单位:南京理工大学 MEMS惯性技术研究中心, 南京 210094
基金项目:国家自然科学基金资助项目(61301214)
摘    要:设计了一款由微机电系统和专用集成电路构成的小型化硅微谐振式加速度计。该加速度计采用80μm厚SOI工艺加工微机电系统(MEMS)结构,采取真空封装技术降低结构噪声。首先,采用振荡信号作为自动增益控制电路中斩波器的控制信号,降低了闪变噪声且不会引入额外的功耗。其次,使用线性区工作的乘法器取代传统的吉尔伯特单元,通过大幅降低系统总体供电电压来降低功耗。最后,采用复位计数器进行频率数字转换,在所关心的带宽内抑制量化噪声。实验显示:该加速度计在达到±30 g线性量程的前提下,实现了2.5μg/√Hz的分辨率和1μg的零偏不稳定度。此外,为了减小电路自身发热引起的温度漂移,该样机的功耗被控制在3.5mW以内,系统集成后的尺寸约为45mm×30mm×20mm。基于所述技术,系统在体积、功耗和性能方面均有较大的提升。

关 键 词:硅微谐振式加速度计  专用集成电路  SOI工艺  真空封装  小型化  低功耗
收稿时间:2016-02-10

Implementation and measurement of a miniaturized silicon resonant accelerometer
ZHAO Jian,SHI Qin,XIA Guo-ming,QIU An-ping,WU Zhi-qiang,SU Yan.Implementation and measurement of a miniaturized silicon resonant accelerometer[J].Optics and Precision Engineering,2016,24(8):1927-1933.
Authors:ZHAO Jian  SHI Qin  XIA Guo-ming  QIU An-ping  WU Zhi-qiang  SU Yan
Affiliation:MEMS Inertial Technology Research Center, Nanjing University of Sci. & Tech., Nanjing 210094, China
Abstract:A miniaturized Silicon Resonant Accelerometer(SRA) consisting of a MEMS (Micro-electro-mechanical System) and an ASIC(Application Specific Integrated Circuit) readout circuit is designed. The MEMS sensor is fabricated by an 80 μm thick SOI process and the noise in the ASIC is reduced by a series of vacuum packaging technologies. Firstly, a vibration signal is used as the control signal of a chopper in automatic gain control circuit to reduce the flicker noise and extra power consumption. Then, a multiplier in the linear area multiplier is used to replace the traditional Gilbert unit to reduce power consumption by sharply reducing system power supply voltage. Finally, a reset counter is taken in digital frequency conversion to inhibit quantization noise in the concerned bandwidth. The experiments show that the proposed SRA achieves sub-μg bias instability and 2.5 μg/√Hz velocity random walk within ±30 g full scale. Moreover, to reduce the temperature drifting due to self heating, the power consumption of the SRA has been carefully limited under 3.5 mW. After integration, the entire prototype occupies a space of 45 mm×30 mm×20 mm. It is characterized by high performance, low power and good miniaturization.
Keywords:Silicon Resonant Accelerometer(SRA)  Application Specified Integrated Circuit (ASIC)  SOI process  vacuum packaging  miniaturization  low power
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