一体化半导体激光器的ANSYS热仿真及结构设计

传统半导体激光器与驱动控制器多采用分离式设计,故半导体激光器系统的体积很难紧凑化,而一体化半导体激光器存在电路集成度高,发热严重等问题,因此,本文提出了对半导体激光器进行一体化、小型化设计的方法。为了保证所设计的半导体激光器运行时系统温度分布均匀,输出激光不受温度变化影响,在结构设计之前,利用ANSYS软件对元器件集成度较高的电路板等热源进行了热仿真,提高了集成后结构的可靠性。仿真结果显示,优化设计后的半导体激光器一体化结构满足激光器温度要求,系统温度分布均匀,能保证激光器稳定运行。设计的新型半导体激光器的整体结构尺寸仅为85mm×95mm×115mm,不仅实现了半导体激光器与驱动控制器的一体化与小型化集成,并且结构中留有准直光路设计空间,便于后期的应用研究。

Structural design and ANSYS thermal simulation for semiconductor laser system

Conventional semiconductor laser technology always chooses a separate design with its controller system, so that the semiconductor laser volume can not be compressed any more. Meanwhile, the integrated structure of the semiconductor laser has serious radiation heat. To overcome the problems mentioned above, this paper proposes a new design method of the semiconductor laser for its integration and miniaturization. To guarantee the laser to be operated stably and to show good thermal management, the ANSYS software is used to perform a thermal simulation for the high-density components such as Print Circuit Board(PCB) to improve the structure reliability before the structure manufacturing. Simulation experiments indicate that designed novel structure allows the semiconductor laser to integrate with the drive controller., and has uniform temperature distribution and an appropriate space, and can guarantee the laser to operate stably. The whole sizes of the semiconductor is only 85 mm×95 mm×115 mm. Moreover, the appropriate space is left in the structure of the semiconductor, which is conductive to the design of a collimated light path for its future applications.