Improvements on the wear resistance of high thermal conductivity Cu alloys using an electroless Ni-P coating prior to PVD deposition |
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Authors: | J.C. Avelar-Batista E. Spain J. Housden |
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Affiliation: | a Tecvac Ltd, Buckingway Business Park, Swavesey, Cambridge, CB4 5UG, United Kingdom b Copperplas International Ltd., Trefree Parc, Llangarron, Ross on Wye, HR9 6PL, United Kingdom |
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Abstract: | An attempt to improve the load support for hard PVD coatings on soft Cu alloys has been made by using a medium phosphorous content electroless Ni-P coating prior to PVD deposition, envisaging the application of these coating/substrate systems in plastic injection moulding. Several PVD coatings, including TiN, CrN, CrAlN, multilayered CrAlN, WC-C, multilayered CrAlN/WC-C were deposited onto an Ampcoloy 940 Cu alloy in two conditions: ‘standard’ and electroless Ni-P plated. The effect of the electroless Ni-P coating on the coating/substrate performance was evaluated by pin-on-disc wear and impact tests. Ultra-microhardness and surface roughness measurements were also used to characterise the resulting coating/substrate systems. The electroless Ni-P coating reduced the wear rates of the PVD-coated Cu alloys and increased the impact wear resistance. Among the PVD coatings trialled, CrN, CrAlN and multilayered CrAlN coatings on electroless Ni-P provided the lowest wear rates. |
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Keywords: | PVD coatings Electroless Ni-P coatings Cu alloy Plastic injection moulding |
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