| 电子产品可靠性工程 |
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| 引用本文： | 黎旺星. 电子产品可靠性工程[J]. 电子质量, 2005, 0(12): 42-43 |
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| 作者姓名： | 黎旺星 |
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| 作者单位： | 广东行政学院,广州,510500 |
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| 摘 要： | 本文分析了在工程应用中元器件失效的原因,并提出了相应的解决方案.
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| 关 键 词： | 产品可靠性 生产工艺 元器件 应力结构 热设计 |
| 文章编号： | 1003-0107（2005）12-0042-02 |
The Reliability Engineering of Electronic Product |
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| Li Wang-xing. The Reliability Engineering of Electronic Product[J]. Electronics Quality, 2005, 0(12): 42-43 |
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| Authors: | Li Wang-xing |
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| Affiliation: | Guangdong Administration School, Guangzhou 510500,China |
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| Abstract: | The paper analyzed reason of components failure in the engineering application,andgave solution. |
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| Keywords: | Product reliability Technology of production Components Stress structure thermaldesign |
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