| 电子组装用高温无铅钎料的研制 |
| |
| 引用本文： | 房卫萍,史耀武,夏志东,郭福,雷永平.电子组装用高温无铅钎料的研制[J].电子元件与材料,2008,27(3):15-18. |
| |
| 作者姓名： | 房卫萍 史耀武 夏志东 郭福 雷永平 |
| |
| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100022 |
| |
| 基金项目： | 国家科技支撑重点项目
,
北京市属市管高校人才强教计划 |
| |
| 摘 要： | Bi-Ag合金是一种替代高铅钎料的芯片封装无铅焊料。研制了Bi-2.5Ag、Bi-2.5Ag-0.1RE、Bi-5Ag-0.1RE、Bi-7.5Ag-0.1RE、Bi-10Ag、Bi-10Ag-0.1RE钎料。结果表明,该合金系钎料的熔化温度范围随Ag含量的增加而增大,而且其润湿性能良好,润湿角都处于30o～40o。不同Ag含量的Bi-Ag/Cu接头在界面处发生断裂,剪切强度差别不大,都略大于30MPa。Bi-Ag/Cu界面没有金属间化合物形成,结合强度较弱。
|
| 关 键 词： | 金属材料 无铅钎料 Bi-Ag合金 |
| 文章编号： | 1001-2028(2008)03-0015-04 |
| 修稿时间： | 2007年12月5日 |
Development of high-temperature Pb-free solder for power die attachment |
| |
| FANG Wei-ping,SHI Yao-wu,XIA Zhi-dong,GUO Fu,LEI Yong-ping.Development of high-temperature Pb-free solder for power die attachment[J].Electronic Components & Materials,2008,27(3):15-18. |
| |
| Authors: | FANG Wei-ping SHI Yao-wu XIA Zhi-dong GUO Fu LEI Yong-ping |
| |
| Affiliation: | FANG Wei-ping,SHI Yao-wu,XIA Zhi-dong,GUO Fu,LEI Yong-ping(College of Material Science , Engineering,Beijng University of Technology,Beijng 100022,China) |
| |
| Abstract: | Bismuth-silver alloy can replace high Pb solders as a viable Pb-free power die-attach solder.Bi-Ag system lead-free solders including Bi-2.5Ag,Bi-2.5Ag-0.1RE,Bi-5Ag-0.1RE,Bi-7.5Ag-0.1RE,Bi-10Ag,Bi-10Ag-0.1RE were developed.The results indicate that the fused temperature of the Bi-Ag solders show a strongly increase with increase of Ag content.The Bi-Ag solders have good wettability and the range of wetting angle varies from 30°to 40°.The shear strengthes of the Bi-Ag solder joints with various Ag contents are almost the same and fracture occurs at the interface.There are no intermetallics generated at Bi-Ag/Cu interface,that lead to weak bonding intensity. |
| |
| Keywords: | metallic material lead-free solder Bi-Ag alloy |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
