Free abrasive wire saw machining of ceramics

Currently, many kinds of ceramics are used in advanced industrial fields due to their superior mechanical properties, such as thermal, wear, corrosion resistance, and lightweight features. Wire saw machining ceramic (Al₂O₃) was investigated by ultrasonic vibration in this study. Taguchi approach is a powerful design tool for high-quality systems. Material removal rate, wafer surface roughness, steel wire wear, kerf width, and flatness during machining ceramic were selected as quality character factors to optimize the machining parameters (swinging angle, concentration, mixed grain and direction of ultrasonic vibration) to get the larger-the-better (material removal rate) and the smaller-the-better (wafer surface roughness, steel wire wear, kerf width and flatness) machining characteristics by Taguchi method. The results indicated that wire swinging produces a higher material removal rate and good wafer surface roughness. Ultrasonic vibration improved material removal rate, without affecting the flatness under different machining conditions. Experimental results show that the optimal wire saw machining parameters based on grey relational analysis can be determined effectively and material removal rate increases from 2.972 to 3.324 mm²/min, wafer surface roughness decreases from 0.37 to 0.34 μm, steel wire wear decreases from 0.78 to 0.77 μm, kerf width decreases from 0.352 to 0.350 mm, and flatness decreases from 7.51 to 7.22 μm are observed.