叠层片式电感三层电镀

介绍了叠层片式电感三层端头电极即银基底电极、镍层、锡－铅合金镀层的性能及制备工艺。提出三层端头电极的质量控制，并分析了常见的质量问题。银端头的质量取决于合适的银端`浆烧成曲线和烧结气氛；镀镍层应有较低的内应力，镀镍层内应力受镀镍液各成分浓度、无机杂质、有机杂质和pH值的影响；MLCI端头电极锡－铅合金电镀工艺及维护，镀后的清洗、MLCI的储存影响镀层的耐焊性和可焊性，对锡－铅合金镀层的耐焊性和可焊性进行了检验以获得合格的MLCI产品。

Multilayer chip inductor (MLCI) tri-layer-plating

Properties and preparing process of tri layer films with Ag base coating, Ni electrodeposit, Sn Pb alloy for terminal electrode of multilayer chip inductor were described. Quality control of tri layer terminal electrode was presented, and common problems were analyzed. The quality of terminal Ag base coating depends on suitable terminal Ag slurry, fit firing curve and atmosphere. Low inner stress which is required by Ni electrodeposit is influenced by concentration of bath components, in organic and organic impurities and pH value. Solderability of Sn Pb alloy deposit is determined by electroplating process and its maintenance, post treatment rinsing, storage of MLCI, etc. Therefore, solderability of Sn Pb alloy deposit was tested for qualified MLCI products.