面向当今封装的挠性印制电路板

挠性电路的特征适合于元件之间要求高密度互连的应用,其安装和连接的挠性特征,高密度电路的精确能力,耐热性能,电路终端选择的多样性以及材料和空间的有效使用等使挠性电路在当前和未来的封装应用中具有广阔的应用前景。

Flexible Printed Circuit for Today''''s Packaging

The characteristics of flexible circuits are ideally suited for many applications that require high density interconnect between other components in a system. Their ability to be formed for installation and attachment, high density circuit definition capability, thermal management, wide variety of circuit termination options, and efficient use of materials and space make flex circuits an attractive solution for a wide variety of current and emerging packaging applications.