| Abstract: | This article addresses the subtle changes necessary to achieve a margin against an intrinsic failure mechanism in a highly
time-constrained development world. The problem of a coefficient of thermal expansion mismatch between a liquid crystal polymer
connector and a FR4 substrate was exacerbated by the size, dimensions, and ball-grid array attachment for such a connector.
By carefully controlling the solder-mask wall profile, opening, and overhang, it was possible to avoid the time- and resource-consuming
option of changing the connector materials.
Kris Frutschy earned his Ph.D. in mechanical engineering at Brown University in 1997. He is currently a senior mechanical engineer at Intel
Corporation.
Ken Kinsman earned his Ph.D. in materials science at Standford University in 1966. He is currently a technology platform manager at Intel
Corporation. Dr. Kinsman is also a member of TMS.
Zezhong Fu earned his Ph.D. in materials science at the California Institute of Technology in 1993. He is currently a senior engineer
at Intel Corporation.
Deepak Goyal earned his Ph.D. in materials science and engineering at SUNY at Stony Brook. He is currently a staff packaging engineer
at Intel Corporation.
Gay Samuelson earned her Ph.D. in biochemistry at the University of Wisconsin-Madison in 1969. She is currently a lab manager at Intel
Corporation.
Ryan Vogt earned his M.S. in materials science and engineering at the University of Arizona in 1995. He is currently a package quality
and reliability engineer at Intel Corporation. |
