Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints |
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Authors: | Ning Zhang Yaowu Shi Zhidong Xia Yongping Lei Fu Guo Xiaoyan Li |
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Affiliation: | (1) College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing, 100022, Peoples’ Republic of China |
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Abstract: | Charpy impact specimens of eutectic Sn37Pb and Sn3.8Ag0.7Cu solder joints with U-type notch were prepared to investigate the
joint impact strength. The gap sizes of the butt joint were selected at 0.3 and 0.8 mm. Compared with the values of 0.3 mm
joint gap, the impact absorbed energies of two solder joints were increased at the joint gap of 0.8 mm. The impact strengths
of Sn37Pb joints were higher than those of Sn3.8Ag0.7Cu joints in both cases. From the macrographic observation of the fracture
path, when the gap was 0.3 mm, the crack initiation of two solder joints located at the root of U-type notch then propagated
along one interface of the joint. For the Sn37Pb joints, the fracture path was not changed at 0.8 mm gap size. However, the
fracture path of Sn3.8Ag0.7Cu joint was totally changed and the fracture occurred not at the root of pre-U notch but from
one side of the solder/Cu interfaces. From the micrographic observation, the crack of the Sn37Pb joints was concentrated on
the Pb-rich layer in the vicinity of interfacial intermetallic (IMC) layer and the fracture morphology mainly appeared to
be a ductile-like structure. Meanwhile, the fracture of Sn3.8Ag0.7Cu joints propagated along either the interface of IMC/solder
or within the IMC layer and showed a brittle failure mode. |
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