| 基于增强现实技术的BGA芯片辅助定位 |
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| 引用本文： | 周卫星,秦笛,白洁,陈炳锐. 基于增强现实技术的BGA芯片辅助定位[J]. 电子测量技术, 2010, 0(9): 56-59 |
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| 作者姓名： | 周卫星 秦笛 白洁 陈炳锐 |
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| 作者单位： | 华南师范大学,广州,510006;华南师范大学,广州,510006;华南师范大学,广州,510006;华南师范大学,广州,510006 |
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| 基金项目： | 广东省工业攻关项目(2008B80701053):基于图像重构的BGA辅助定位系统 |
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| 摘 要： | 提出了一种基于增强现实技术的BGA芯片的辅助定位方法。该方法通过图像处理,将定位过程中的待焊芯片用一个重构的透明芯片的图像代替,使操作者在监视屏上可同时看见电路板上的焊盘和BGA芯片底部的焊球,定位操作的直观性和准确性都有了很大的提高。采用VC＋＋与HALCON相结合的方法实现了该系统,实验表明该方法达到了预期的效果。
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| 关 键 词： | BGA芯片定位 增强现实 图像分割 |
Accessorial location method with BGA package based on Augmented Reality |
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| Zhou Weixing,Qin Di,Bai Jie,Chen Bingrui. Accessorial location method with BGA package based on Augmented Reality[J]. Electronic Measurement Technology, 2010, 0(9): 56-59 |
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| Authors: | Zhou Weixing Qin Di Bai Jie Chen Bingrui |
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| Affiliation: | Zhou Weixing Qin Di Bai Jie Chen Bingrui(South China Normal University,Guangzhou 510006) |
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| Abstract: | In this paper,a new method—An accessorial location method with BGA package based on Augmented Reality is proposed.The real BGA chip is substituted by a reconstruction image sin the course of location.The method of image processing enables the monitor to display the bonding pad of PCB and solder ball of BGA chip at the same time.It greatly enhances the visibility and accuracy of location.The experiment comes off satisfactorily by the VC＋＋ and HALCON. |
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| Keywords: | location with BGA package Augmented Reality image segmentation |
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