| 62Sn36Pb2Ag钎料中Ag元素对AgCu/SnPbAg/CuBe焊缝性能的影响 |
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| 引用本文： | 丁颖,申坤,张冉. 62Sn36Pb2Ag钎料中Ag元素对AgCu/SnPbAg/CuBe焊缝性能的影响[J]. 焊接学报, 2011, 32(8): 65-68 |
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| 作者姓名： | 丁颖 申坤 张冉 |
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| 作者单位： | 1. 北京控制工程研究所,北京,100190
2. 北京工业大学机械工程与应用电子学院,北京,100124 |
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| 基金项目： | 航天科技集团公司重大工艺基金资助项目 |
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| 摘 要： | 分别采用62Sn36Pb2Ag钎料和63Sn37Pb共晶钎料焊接AgCu合金块和CuBe合金片进行试验,对比分析两种钎料形成的焊缝性能和显微组织结构,阐述了62Sn36Pb2Ag钎料中Ag元素的存在对AgCu/SnPbAg/CuBe焊缝性能的影响机制.结果表明,62Sn36Pb2Ag钎料中的Ag元素对于润湿铺展状态的改...
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| 关 键 词： | 锡铅银钎料 银基合金 钎焊 |
| 收稿时间： | 2010-06-22 |
Influence of Ag element in 62Sn36Pb2Ag on properties of AgCu/SnPbAg/CuBe solder joint |
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| DING Ying,SHEN Kun and ZHANG Ran. Influence of Ag element in 62Sn36Pb2Ag on properties of AgCu/SnPbAg/CuBe solder joint[J]. Transactions of The China Welding Institution, 2011, 32(8): 65-68 |
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| Authors: | DING Ying SHEN Kun ZHANG Ran |
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| Affiliation: | Beijing Institute of Control Engineering, Beijing 100190, China,Beijing Institute of Control Engineering, Beijing 100190, China and College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China |
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| Abstract: | 62Sn36Pb2Ag solder and 63Sn37Pb eutectic solder were adopted to join the AgCu alloy bulk and CuBe alloy sheet. The mechanical properties and the relative microstructure for both solder joints were compared and analyzed by the experimental studies. The influence mechanism of Ag element in 62Sn36Pb2Ag on the properties of the AgCu/SnPbAg/CuBe solder joint was elaborated in detail accordingly. The results show that the Ag element in the solder changes the wetting behavior and benefits the less voids, the dispersed distribution of the Ag3Sn particles contributes the dislocation clinching and results in the higher solder joint strength, and the nearly saturated state of Ag content in the solder joint under the soldering temperature prevents the brittle Ag3Sn phase enriching near the interface and gives the ideal microstructure of the solder joint. |
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| Keywords: | 62Sn36Pb2Ag solder Ag-based alloy soldering |
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