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硅树脂基复合材料的制备及耐热性能和弯曲强度
引用本文:许健,吴连斌,陈利民,陈遒,蒋剑雄.硅树脂基复合材料的制备及耐热性能和弯曲强度[J].高分子材料科学与工程,2012(3):145-147,152.
作者姓名:许健  吴连斌  陈利民  陈遒  蒋剑雄
作者单位:杭州师范大学有机硅化学及材料技术教育部重点实验室
基金项目:杭州市市属高校重点实验室科技创新项目(20080431T02)
摘    要:以氯硅烷为原料合成了一种新型的甲基苯基硅树脂,并制备了复合材料。通过热重分析、扫描电镜研究了复合材料的热性能和填料分布,分析了影响复合材料弯曲强度的可能因素。实验结果表明,复合材料的热稳定性优良,在N2气氛下升温至800℃时,热失重仅为4.4%;复合材料截面为连续相,填料在硅树脂中分散均匀,两者相容性较好;填料的添加量、硅树脂的苯基含量及凝胶化时间是材料弯曲强度的三个主要影响因素。

关 键 词:硅树脂  复合材料  热性能  弯曲强度

Preparation of the Silicone Resin-Based Composites and Study of Its Heat Resistance and Bending Strength
Jian Xu,Lianbin Wu,Limin Chen,Qiu Chen,Jianxiong Jiang.Preparation of the Silicone Resin-Based Composites and Study of Its Heat Resistance and Bending Strength[J].Polymer Materials Science & Engineering,2012(3):145-147,152.
Authors:Jian Xu  Lianbin Wu  Limin Chen  Qiu Chen  Jianxiong Jiang
Affiliation:(Key Laboratory of Organosilicon Chemistry and Material Technology Ministry of Education,Hangzhou Normal University,Hangzhou 310012,China)
Abstract:Composites were prepared by fillers and silicone resin which was synthesized by the chlorosilane.Thermal properties and section′s micrograph of the composites were studied by thermogravimetric analysis(TGA) and scanning electron microscope(SEM).The results of the experiments show the thermal property of the composites is excellent,its mass loss is only 4.4% when being heated to 800 ℃ in N2.The cross section of the composite is the continuous phase and the filler was uniformly distributed in the silicone resin.The filler and silicone resin’s compatibility is good.The content of quartz powder,gel time and phenyl′s content of the silicone resin are three main factors of the composites′ bending strength.
Keywords:silicone resin  composite  heat resistance  bending strength
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