| 基于正交试验法的高速背板焊点热疲劳可靠性分析 |
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| 引用本文： | 张立强,吴兆华,李永利,陈小勇.基于正交试验法的高速背板焊点热疲劳可靠性分析[J].电子质量,2009(3):45-47. |
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| 作者姓名： | 张立强 吴兆华 李永利 陈小勇 |
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| 作者单位： | 桂林电子科技大学机电工程学院,广西桂林,541004 |
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| 摘 要： | 针对某特定电子整机的布局，研究了背板的备用线数量及接口布局；以高速互联背板焊点为研究对象，基于正交试验法，建立不同组合水平下的有限元分析模型；利用ANSYS软件，对背板焊点在热循环加载条件下的热应力分析，利用修正后的Coffin-Manson方程对其进行寿命预测，获得了较好的结果。
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| 关 键 词： | 背板 热循环 有限元 热疲劳寿命 |
Thermal Fatigue Reliability Analysis of High Speed Backplane Solder Joint Based on Orthogonal Experiment |
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| Zhang Li-qiang,Wu Zhao-hua,Li Yong-li,Chen Xiao-yong.Thermal Fatigue Reliability Analysis of High Speed Backplane Solder Joint Based on Orthogonal Experiment[J].Electronics Quality,2009(3):45-47. |
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| Authors: | Zhang Li-qiang Wu Zhao-hua Li Yong-li Chen Xiao-yong |
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| Affiliation: | School of Mechanical & Electrical Engineering;GuiLin University of Electronic Technology;Guangxi GuiLin 541004 |
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| Abstract: | With a special electrical equipment, research on the standby line number and the interface layout in the backplane. The solder joints in the highspeed backplane are taken as research object, Based on the orthogonal experiment , established the different combined finite element analysis models; Analyzed the backplane solder joint under thermal cyclic by using ANSYS, and used the modified CoffinManson equation predict their thermal fatigue life, obtain some good results. |
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| Keywords: | backplane thermal cycles finite element thermal fatigue life |
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