Consideration of temperature and current stress testing on flip chip solder interconnects |
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| Authors: | Alfred Yeo Bernd Ebersberger Charles Lee |
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| Affiliation: | 1. Chartered Semiconductor Manufacturing Ltd., 60 Woodlands Industrial Park D, Street 2, Singapore 738406, Singapore;2. Infineon Technologies AG, 81726 Munich, Germany;3. A1STAR – Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685, Singapore;1. Zarghan Branch, Islamic Azad University, Zarghan, Iran;2. Department of Physics, College of Sciences, Yasouj University, Yasouj 75914-353, Iran;1. Department of Obstetrics and Gynecology, Union Hospital, Huazhong University of Science and Technology, Wuhan, Hubei, PR China;2. Cancer Center, Union Hospital, Tongji Medical College, Huazhong University of Science and Technology, Wuhan, Hubei, PR China;1. Department of Radiology and Imaging Sciences, Emory University School of Medicine, Atlanta, GA, United States;2. Department of Pathology, Emory University, Atlanta, GA, United States;3. Biostatistics & Bioinformatics Shared Resource at Winship Cancer Institute of Emory University, Atlanta, GA, United States;4. Otolaryngology Head and Neck Surgery, Emory University, Atlanta, GA, United States;5. Hematology Oncology, Winship Cancer Institute of Emory University, Atlanta, GA, United States;1. Laboratoire de Chimie Inorganique, Ur-11-Es-73, Faculté des Sciences de Sfax, BP 1171, 802, Université de Sfax, Tunisie;2. Laboratoire de Physico-Chimie des Matériaux Minéraux et leurs Applications, Centre National de Recherches en Sciences des Matériaux, B. P. 95, Hammam-Lif 2050, Tunisie;3. Institut des Molécules et Matériaux du Mans, IMMM, UMR CNRS 6283, Université du Maine, 72085 Le Mans Cedex 9, France;1. ANKA/Institute for Photon Science and Synchrotron Radiation (IPS), Karlsruhe Institute of Technology (KIT), 76344 Eggenstein-Leopoldshafen, Germany;2. Department of Materials Science and Engineering, National Chiao Tung University, Hsin-chu 30010, Taiwan, ROC;3. Laboratory for Applications of Synchrotron Radiation (LAS), Karlsruhe Institute of Technology (KIT), 76049 Karlsruhe, Germany;4. ESRF – The European Synchrotron, 71 Avenue des Martyrs, 38000 Grenoble, France;5. Department of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-595, USA |
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| Abstract: | This work discusses the experimental set-up and data interpretation for high temperature and current stress tests of flip chip solder joints using the four-point Kelvin measurement technique. The single solder joint resistance responses are measured at four different four-point Kelvin structure locations in a flip chip package. Various temperatures (i.e., 125–165 °C) and electric current (i.e., 0.6–1.0 A) test conditions are applied to investigate the solder joint resistance degradation behavior and its failure processes. Failure criterion of 20% and 50% joint resistance increases, corresponding to solder and interfacial voiding, are employed to evaluate the solder joint electromigration reliability. The absolute resistance value is substantially affected by the geometrical layout of the metal lines in the four-point Kelvin structure, and this is confirmed by finite element simulation.Different current flow directions and strengths yielded different joint resistance responses. The anode joint, where electrons flow from the die to the substrate, usually measured an earlier resistance increase than the cathode joint, where electrons flow in the opposite direction. The change in measured joint resistances can be related to solder and interfacial voiding in the solder joint except for ±1 A current load, where resistance drop mainly attributed to the broken substrate Cu metallization as a result of “hot-spot” phenomenon. The solder joint temperature increases above the oven ambient temperature by ～25 °C, ～40 °C and ～65 °C for 0.6 A, 0.8 A and 1.0 A stress current, respectively. It is found that two-parameter log-normal distribution gives a better lifetime data fitting than the two-parameter Weibull distribution. Regardless of failure criterion used, the anode joint test cells usually calculated a shorter solder joint mean life with a lower standard variation of 0.3–0.6, as compared to the cathode joint test cells with a higher standard variation of 0.8–1.2. For a typical flip chip solder joint construction, electromigration reliability is mainly determined by the under bump metallization consumption and dissolution, with intermetallic compound formation near the die side of an anode joint. |
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