有机硅硼改性环氧耐高温胶粘剂

采用自制有机硅硼树脂改性双酚A环氧树脂，配合AG-80环氧树脂，改性咪唑为固化剂，得到80～100℃固化的无溶剂耐高温胶粘剂。室温剪切强度大于15MPa，200℃剪切强度大于8Mpa，分析表明，该树脂体系具有优异的耐温性能。200℃／1000h老化具有较高的粘接强度，DSC分析表明，具有良好的热稳定性。扫描电镜分析表明，二元改性体系中存在均匀的“孔洞”结构和微分相，可以减小应力集中和阻止断裂发生，达到增韧效果。

Organic slicon-boron resin modified high temperature resistant epoxy adhesive

The high temperature resistant epoxy adhesive was prepared with organic silicon-boron resin modified bisphenol A-based epoxy resin, AG-80 epoxy resin,carboxyl-terminated butadiene acrylonirrile rubber（CTBN） and modified imidazole as the curing agent.The adhesive is a solvent-free high temperature resistant adhesive,the shearing strength of which is over 15 MPa and 8 MPa at room temperature and 200℃,respectively, after curing at 80-100 ℃ for 4 hours. The results of shearing strength showed that the resin system has excellent resistance to high temperature and the bonding strength is still higher after ageing at 200℃ for 1 000 hours.DSC analysis indicated that the adhesive has good therma stability.The SEM photographs revealed that the modified dual system has numbers of evenly distributed ＂holes＂ and the microcosmic phase separation structure,which can decrease the stress concetration,break down the crack propagation and achieve the toughening effect.